View MTSM2350-G-A_4577609.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

part no. : MTSM2350-G-A 3.2 x 2.8mm smd type observe precaution for handling electro static sensitive devices attention 3northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www.marktechopto.com specification
0t60*$ 3.2 x 2.8mm smd type ver.: 01 date: 2006/11/23 page: 1 /6 package dimensions 3.2 0.8 1.9 0.9 3.6 0.14 0.6 2.4 2.2 2.8 0.8 k a notes: 1. all dimensions are in mm. 2. tolerance is 0.25mm unless otherwise noted. description led chip part no. material emitting color lens color MTSM2350-G-A ingan/sapphire tru e green water clear
ver.: 01 date: 2006/11/23 page: 2 /6 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 120 mw reverse voltage v r 5 v d.c. forward current if 30 ma peak current(1/10duty cycle,0.1ms pulse width.) if(peak) 100 ma operating temperature range topr. -25 to +85
storage temperature range tstg. -40 to +100
soldering temperature tsld. reflow soldering: 260
gpstfd hand soldering: 350
gpstfd electric static discharge threshold (hbm) esd 6000 v electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity i v if=20ma 270 620 mcd forward voltage vf if=20ma 3.2 4.0 v peak wavelength p if=20ma ----- nm dominant wavelength d if=20ma 525 nm reverse current ir vr=5v 50 a viewing angle 21/2 if=20ma 120 deg spectrum line halfwidth ? if=20ma 35 nm notes: 1.the datas tested by is tester. 2. customer?s special requirements are also welcome. 0t60*$ 3.2 x 2.8mm smd type
ver.: 01 date: 2006/11/23 page: 3 /6 typical electrical/optical characteristic curves (25
ambient temperature unless otherwise noted) applied voltage (v) forward current if(ma) 10 20 40 30 50 1.62.02.43.03.44.0 20.0 forward current (ma) relative luminous intensity 10.0 0 200 400 800 600 1000 30.0 0.0 forward current vs. applied voltage forward current vs. luminous intensity ambient temperature ta ( f c) 0204060 100 80 forward current if(ma) 10 20 40 30 50 0.6 0.3 0.7 0.5 0.1 0.4 0.2 20 0 10 30 40 50 60 70 80 90 0.8 0.9 1.0 ambient temperature vs. forw ard current radiation diagram 0t60*$ 3.2 x 2.8mm smd type
ver.: 01 date: 2006/11/23 page: 4 /6 precaution in use storage recommended storage environment temperature: 5 o c ~ 30 o c (41 o f ~ 86 o f) humidity: 60% rh max. use within 7 days after opening of sealed vapor/esd barrier bags. if the mois ture absorbent mater ial (s ilica ge l) has faded a way or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 60 ? 5
for 24 hours. fold the opened bag firmly and keep in dry environment. soldering reflow soldering hand soldering lead solder lead C free solder pre-heat 120~150
180~200
temperature 350
max. pre-heat time 120sec. max. 120sec. max. soldering time 3sec. max. peak temperature 240
max. 260
max. (one time only) soldering time 10sec. max. 10sec. max. condition refer to refer to t emperature- temperature- profile 1 profile 2 *after reflow soldering rapid cooling should be avoided. [temperature-profile (surface of circuit board)] use the conditions shown to the under figure. ? 1 : lead solder ? 2 : lead-free solder 120sec. max. 60sec. max. pre-heating 120~150 c 2.5~5 c/sec. 2.5~5 c/sec. 240 c max. 10sec. max. 120sec. max. 60sec. max. pre-heating 180~200c 1~5c/sec. 260 c max. 10sec. max. 1~5 c/sec. [ recommended soldering pad design ] use the following conditions shown in the figure. 2.2 1.8 1.4 1.4 (unit:mm) 0t60*$ 3.2 x 2.8mm smd type
ver.: 01 date: 2006/11/23 page: 5 /6 handling of silicone resin leds handling indications during processing, mechanical stress on the surface should be minimiz ed as much as possible. sharp objects of all all types should not be used to pierce the sealing compound figure 1 in general, leds should only be handled from th e side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched. figure 2 when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin muxt be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. 0t60*$ 3.2 x 2.8mm smd type
ver.: 01 date: 2006/11/23 page: 6 /6 dimensions for tape 2.0 4.0 1.75 5.5 12.0 dimensions for reel 13.2 0.5 16.2 0.5 178.0 1 0.4 0.6 0.2 0.8 60.00.5 57 0.6 4 .2 notes : 1.all dimensions are in mm, tolerance is2.0mm unless otherwise noted. 2.specifications are subject to change without notice. 0t60*$ 3.2 x 2.8mm smd type

▲Up To Search▲

Price & Availability of MTSM2350-G-A

	To Download MTSM2350-G-A Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .